WB7 hardware revisions: различия между версиями

внесены партии v7.3.3D/2, v7.3.3D/3, v7.3.3D/3P, v7.3.3D/5, v7.3.3D/6
(внесена партия v7.3.3D/4)
(внесены партии v7.3.3D/2, v7.3.3D/3, v7.3.3D/3P, v7.3.3D/5, v7.3.3D/6)
Строка 18: Строка 18:
|-
|-
|7.3.3
|7.3.3
|'''512MB RAM + 8GB eMMC Ind''': v7.3.3B/1, v7.3.3C/4, v7.3.3C/6 <br>
|'''512MB RAM + 8GB eMMC Ind''': v7.3.3B/1, v7.3.3C/4, v7.3.3C/6, v7.3.3D/2 <br>
'''1GB RAM + 8GB eMMC Ind''': v7.3.3A/1, v7.3.3A/2, v7.3.3B/2, v7.3.3B/5, v7.3.3C/1, v7.3.3C/5, v7.3.3D/1 <br>
'''1GB RAM + 8GB eMMC Ind''': v7.3.3A/1, v7.3.3A/2, v7.3.3B/2, v7.3.3B/5, v7.3.3C/1, v7.3.3C/5, v7.3.3D/1, v7.3.3D/6 <br>
'''2GB RAM + 64GB eMMC Ind''': v7.3.3B/3, v7.3.3C/3 <br>
'''2GB RAM + 64GB eMMC Ind''': v7.3.3B/3, v7.3.3C/3, v7.3.3D/3, v7.3.3D/3P <br>
'''2GB RAM + 64GB eMMC Comm''': v7.3.3B/4, v7.3.3C/2, v7.3.3C/7, v7.3.3D/4 <br>
'''2GB RAM + 64GB eMMC Comm''': v7.3.3B/4, v7.3.3C/2, v7.3.3C/7, v7.3.3D/4 <br>
Специальное исполнение (1GB RAM + 8GB eMMC Ind): v7.3.3D/5
|09.2022 - ...  
|09.2022 - ...  
|Надпись Wiren Board 7 r.3 на нижней стороне печатной платы.
|Надпись Wiren Board 7 r.3 на нижней стороне печатной платы.