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Как разрабатывать ПО для Wiren Board/en: различия между версиями
Как разрабатывать ПО для Wiren Board/en (просмотреть исходный код)
Версия 13:57, 7 июня 2019
, 4 года назадНет описания правки
(Новая страница: «=== General consideration ===») |
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=== General consideration === | === General consideration === | ||
Wiren Board controllers have from 64 to 512MB of RAM, depending on the model. This means that you need to consider memory consumption when developing your programs. For information about how to control memory consumption in Linux, see the website http://www.linuxatemyram.ru/. | |||
=== | === Building packages and programs === | ||
It is recommended to build programs on a Linux computer using a special development environment. Compiling and developing directly on the Wiren Board 5 is not recommended due to the small amount of RAM. | |||
==== | ==== Development environment ==== | ||
The development environment is provided as a Docker container. For its use in Linux, there is a convenient script wbdev. When using an environment, cross-compilation is not necessary. The wbdev script automatically runs the appropriate commands in a virtualized environment with the armel architecture corresponding to the Wiren Board processor architecture. | |||
The Assembly of packages is made by calling the wbdeb, for example: | |||
<pre> | <pre> | ||
$ wbdev chroot # | $ wbdev chroot #run virtualized qemu chroot environment with Debian 7 armel architecture | ||
$ wbdev make # | $ wbdev make # call 'make' in a virtualized qemu chroot environment | ||
$ wbdev cdeb # | $ wbdev cdeb # build a package written in C++ in a virtualized qemu chroot environment | ||
$ wbdev gdeb # | $ wbdev gdeb # build a package written in Go using cross-compile Go | ||
$ wbdev ndeb # | $ wbdev ndeb # collect architecture-independent package, containing for example a project in Python | ||
</pre> | </pre> | ||
Full description of the work with the environment is in the | |||
[https://github.com/contactless/wirenboard/blob/master/README.md documentation]. | |||
=== | === Other articles === | ||
[[ | [[Сборка ядра/en|Kernel compilation]] | ||
[[ | [[Сборка образов прошивки/en|Firmware image biulding]] | ||
[[ | [[Уникальные идентификаторы/en|Unique identifiers]] | ||
[[ | [[eMMC flash storage wear level|eMMC flash storage wear level]] | ||
[[ | [[Device Tree/en|Device Tree]] | ||